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73 ITEMS,1/8PAGE ,
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| PART NO.：K4S561632J-UC75 |
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INFO：K4S561632J-UC75 厂家:SAMSUNG 封装:TSOP
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| PART NO.：K6R4008V1C-TI10 |
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INFO：K6R4008V1C-TI10 厂家: SAMSUNG 封装: TSOP
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| PART NO.：MBRP30045CT |
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INFO：MBRP30045CT 封装:模块 厂家:MOTOROLA
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| PART NO.：PM200CVA060 |
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INFO：PM200CVA060 封装:模块 厂家:MITSUBISHI
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| PART NO.：CM600HA-24H |
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INFO：CM600HA-24H 封装:模块 厂家:MITSUBISHI
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| PART NO.：PP20012HS |
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INFO：PP20012HS 封装:模块 厂家:ABB
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| PART NO.：PKC2132PI |
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INFO：PKC2132PI 封装:模块 厂家:ERICSSON
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| PART NO.：QM100DY-H |
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INFO：QM100DY-H 封装:模块 厂家:MITSUBISHI
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| PART NO.：MC33219AP |
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INFO：MC33219AP 封装:DIP 厂家:MOTOROLA
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| PART NO.：CXD1178Q |
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INFO：CXD1178Q 封装:QFP 厂家:SONY
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